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Multi Layer Structure High Density PCB Board Customized Design For Precise Communication

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Multi Layer Structure High Density PCB Board Customized Design For Precise Communication

Name: Multi Layer Structure High Density PCB Board Customized Design For Precise Communication
Brand: High Density PCB
Price: 1 USD

China Multi Layer Structure High Density PCB Board Customized Design For Precise Communication wholesale

Brand Name : High Density PCB

Place Of Origin : China

Model Number : Varies by goods condition

Certification : ROHS, CE

MOQ : Sample,1 pc(5 square meters)

Price : NA

Payment Terms : T/T,Western Union

Supply Ability : 3000㎡

Delivery Time : 15-17 work days

Min. Solder Mask Clearance : 0.1mm

Count : 1-30 Layer

Cooper Thickness : 2oz Out Layer , 1oz Inner Layer

Surface Finish : HASL, ENIG, OSP

Layer Count : 1-30

Minimum Via Dia : 0.2mm

Impedance Control : ±10%

Board Thickness : 0.2-5.0mm

Board Size : Customizable

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HD PCBs with Different Surface Treatment Processes are Available.:

High Density PCBs (Printed Circuit Boards), or HDPCBs, are advanced circuit boards characterized by high component density, fine line widths/spacings (typically ≤ 0.1mm), small via sizes (e.g., microvias ≤ 0.15mm), and multi-layer structures. Their core advantage lies in enabling miniaturization, high performance, and reliabilityof electronic devices—making them indispensable in industries where space constraints, signal integrity, and functional complexity are critical.

Features:

1.Ultra-fine traces: Line widths/spacings ≤ 0.1mm (even down to 0.03mm), fitting more conductive paths in limited space.
2. Microvias: Tiny holes (≤0.15mm diameter) in blind/buried/stacked designs, connecting layers without wasting surface area.
3. Multi-layer structure: 8–40+ layers (vs. 2–4 for traditional PCBs) to isolate signals/power and integrate complex circuits.
4. High component density: ≥100 components per square inch, enabling mini devices (e.g., smartwatches) with rich functions.
5. Specialized materials: High-Tg FR-4 (heat-resistant), polyimide (flexible), or PTFE (low signal loss) for harsh environments/high frequencies.
6. Strict precision: Tight tolerances (e.g., ±5% line width error, ≤0.01mm layer alignment) to avoid defects in fine structures.
7. Advanced component compatibility: Supports fine-pitch BGA, CSP, and PoP packages, maximizing vertical/horizontal space use.

Applications:

Sector	Use Cases	HDI Advantage
Consumer	Smartphones, AR/VR headsets	50% size reduction vs. conventional PCBs
AI/Computing	GPU accelerators, server GPUs	Supports 25 Tbps/mm² interconnect
Medical	Endoscopic capsules, hearing aids	Reliability in 50 GHz) for signal integrity validation.

Product Tags:

Multi Layer Structure High Density PCB

HASL Surface 8 Layer HD PCB

Multi Layer Structure High Density PCB Board Customized Design For Precise Communication Images

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